Auburn Microelectronics Laboratory

Alabama Microelectronics Science and Technology Center

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Charles Ellis, Director,
Office: 467 Broun Hall
Phone: (334) 844-1883
Welcome to Alabama Microelectronics Science and Technology Center

 

Equipment

Cost

Basis

Wafer Size

Comments

 

 

 

 

 

STS ASE Deep RIE

$150

Hour

4” only

No exposed metal

Ebeam / Sputter

$200 + $100/Add layer

Run + Materials

4 “– 6” Wafers

Assumes normal Dep rates and materials

Mask Aligner/Etch

$25

Batch up to 5 wafers

4 “or 5”

Includes PR/Dev/Matrix Strip

Oxidation Furnace

$100

Hour

4” or 5”

Any Ambient

Chemical Clean

$75

Batch

4” or 5”

RCA

Ni Plating

$100

Plate

Up to 6” Wafers

Up to 20 um/4”wafer

Poly Silicon LPCVD

$250

Run

Up to 1 um

Silicon Nitride LPCVD

$250

Run

Up to 3000 A

Glass/Oxide/Polyimide etch   (AOE DRIE)

$100

Run (1 wafer)

5” or mounted on 5” WAFER

 

Polyimide/LCP Etch

(RIE)

$30

Hour

Up to 6”

O2 or O2 + CF4

Aluminum (Wet)

$20

Run (11 Wafers)

4” or 5”

 

Oxide Etch (Wet)

$20

Run (11 Wafers

4” or 5”

 

PR Asher

$5

Wafer

4” or 5”

Up to 5 min/run

Matrix Nitride, Oxide, or Polysilicon Dry Etch

$50

Batch

4” or 5”

Up to 5 min/run

Anodic Bonding

$150

Wafer set

Any Size

Per Bond

Wafer Saw

$50

Wafer

4” – 6”

Per Mount

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